Ultrasonic investigation of amorphous carbon in various frequencies at low temperatures from 2.1 to 300 K

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	Ultrasonic investigation of amorphous carbon in various frequencies at low temperatures from 2.1 to 300 K
	Wang, RJ ; Li, FY ; Deng, TZ ; Wang, JF ; Chen, H ; Jin, CQ
刊名	SOLID STATE COMMUNICATIONS
	2003
卷号	127 期号:1 页码:47
关键词	BULK METALLIC-GLASS
ISSN号	0038-1098
通讯作者	Wang, RJ (reprint author), Chinese Acad Sci, Inst Phys, Beijing 100080, Peoples R China.
中文摘要	Using pulse echo overlap measurement, the elastic behavior of amorphous carbon has been studied at ambient and low temperatures. The smaller ratio BIG of the bulk modulus to shear modulus and smaller Poisson's ratio sigma at room temperature indicate that there is an intrinsic stiffening of transverse acoustic phonons in the amorphous carbon. The acoustic velocity and attenuation for longitudinal modes have been measured between 2.1 and 300 K at three frequencies of 7, 21 and 35 MHz, respectively. Their frequency and temperature dependence are observed. The elastic constant C-11 increases with decreasing temperature and show enhanced stiffening at low temperatures. In the 130-220 K region, the abnormal change and effect of longitudinal velocity and attenuation with temperature and frequency, and a phase transition associated with structure relaxations are discussed. (C) 2003 Elsevier Science Ltd. All rights reserved.
收录类别	SCI
语种	英语
公开日期	2013-09-23
内容类型	期刊论文
源URL	[http://ir.iphy.ac.cn/handle/311004/46351]
专题	物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式 GB/T 7714	Wang, RJ,Li, FY,Deng, TZ,et al. Ultrasonic investigation of amorphous carbon in various frequencies at low temperatures from 2.1 to 300 K[J]. SOLID STATE COMMUNICATIONS,2003,127(1):47.
APA	Wang, RJ,Li, FY,Deng, TZ,Wang, JF,Chen, H,&Jin, CQ.(2003).Ultrasonic investigation of amorphous carbon in various frequencies at low temperatures from 2.1 to 300 K.SOLID STATE COMMUNICATIONS,127(1),47.
MLA	Wang, RJ,et al."Ultrasonic investigation of amorphous carbon in various frequencies at low temperatures from 2.1 to 300 K".SOLID STATE COMMUNICATIONS 127.1(2003):47.