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Gallium-Incorporated TiN Metal Gate With Band-Edge Work Function and Excellent Thermal Stability for PMOS Device Applications
Xu, QX ; Xu, GB ; Liang, QQ ; Yao, Y ; Duan, XF ; Li, JF
刊名IEEE ELECTRON DEVICE LETTERS
2011
卷号32期号:9页码:1197
关键词HIGH-K CMOS TECHNOLOGY SHIFT
ISSN号0741-3106
通讯作者Xu, QX: Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China.
中文摘要A cost-effective method for modulating the effective work function (EWF) of a metal gate while simultaneously decreasing the equivalent oxide thickness (EOT) of a high-k dielectric is proposed for the first time. By incorporating gallium (Ga) into the TiN/HfLaON/interfacial layer (IL) SiO(2) PMOS gate stack, a band-edge EWF of 5.18 eV and an EOT of 0.57 nm can be obtained. Excellent thermal stability was maintained even after the post metal anneal (PMA) at 1000. degrees C. The impacts of TiN thickness, Ga implant doses, and PMA conditions on the properties of the Ga-incorporated TiN/HLaON/IL SiO(2) gate stack are investigated, and the corresponding possible mechanisms are discussed. This technique has been successfully applied to the gate-first process flow to fabricate PMOSFETs with a minimum gate length of 28 nm.
收录类别SCI
资助信息National Basic Research Program of China (973); China National ST Major Project [02]
语种英语
公开日期2013-09-17
内容类型期刊论文
源URL[http://ir.iphy.ac.cn/handle/311004/38555]  
专题物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式
GB/T 7714
Xu, QX,Xu, GB,Liang, QQ,et al. Gallium-Incorporated TiN Metal Gate With Band-Edge Work Function and Excellent Thermal Stability for PMOS Device Applications[J]. IEEE ELECTRON DEVICE LETTERS,2011,32(9):1197.
APA Xu, QX,Xu, GB,Liang, QQ,Yao, Y,Duan, XF,&Li, JF.(2011).Gallium-Incorporated TiN Metal Gate With Band-Edge Work Function and Excellent Thermal Stability for PMOS Device Applications.IEEE ELECTRON DEVICE LETTERS,32(9),1197.
MLA Xu, QX,et al."Gallium-Incorporated TiN Metal Gate With Band-Edge Work Function and Excellent Thermal Stability for PMOS Device Applications".IEEE ELECTRON DEVICE LETTERS 32.9(2011):1197.
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