An ab initio investigation on boundary resistance for metallic grains

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	An ab initio investigation on boundary resistance for metallic grains
	Zhou, BH ; Xu, Y ; Wang, S ; Zhou, GH ; Xia, K
刊名	SOLID STATE COMMUNICATIONS
	2010
卷号	150 期号:29-30 页码:1422
关键词	ELECTRICAL-RESISTIVITY CU FILMS CONDUCTIVITY COPPER
ISSN号	0038-1098
通讯作者	Zhou, GH: Hunan Normal Univ, Dept Phys, Changsha 410081, Peoples R China.
中文摘要	The electronic transport properties through metallic grain boundaries are investigated by a self-consistent approach combined with wave-function matching. It is demonstrated that the interface resistance, 2SR(GB) (sample area S times resistance R), for a 36.8 degrees [001] tilt grain boundary is 0.604 x 10(-15) Omega m(2), which is comparable with the previous room-temperature experimental result of SR(GB) = 0.36 x 10(-15) Omega m(2) for the common grain boundary of face-centered cubic (fcc) copper. Furthermore, the resistance for a twin boundary is one order of magnitude lower than that of a common grain boundary, and is only half of that for stacking faults of fcc metal copper, as is expected. The results for other fcc metals are also discussed. (C) 2010 Elsevier Ltd. All rights reserved.
收录类别	SCI
资助信息	National Natural Science Foundation of China [10974052, 10574042]; Specialized Research Fund for the Doctoral Program of Higher Education of China [20060542002]
语种	英语
公开日期	2013-09-17
内容类型	期刊论文
源URL	[http://ir.iphy.ac.cn/handle/311004/33607]
专题	物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式 GB/T 7714	Zhou, BH,Xu, Y,Wang, S,et al. An ab initio investigation on boundary resistance for metallic grains[J]. SOLID STATE COMMUNICATIONS,2010,150(29-30):1422.
APA	Zhou, BH,Xu, Y,Wang, S,Zhou, GH,&Xia, K.(2010).An ab initio investigation on boundary resistance for metallic grains.SOLID STATE COMMUNICATIONS,150(29-30),1422.
MLA	Zhou, BH,et al."An ab initio investigation on boundary resistance for metallic grains".SOLID STATE COMMUNICATIONS 150.29-30(2010):1422.