Perceiving and predicting the intended motion with human-machine interaction force for walking assistive exoskeleton robot | |
Yang MY(杨明毅); Xu ZG(徐志刚)![]() ![]() | |
2013 | |
会议名称 | 2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013 |
会议日期 | August 4-7, 2013 |
会议地点 | Takamastu, Japan |
关键词 | Exoskeleton robot Intended motion Human-Machine Interaction force Hybrid control |
页码 | 805-810 |
中文摘要 | The characteristic of man in the loop has always brought lots of difficulties for the control of exoskeleton. To solve these, a hybrid control method based on human-machine interaction force (HMIF) is proposed and applied to the control of lower limb exoskeleton in this paper. We innovatively combine ground contact pressure and body contact force together and give full play to their respective advantages. With the virtual modification of human limb impedance properties, the nature of the human body energy saving with exoskeleton is revealed. One of the greatest strengths of this control strategy is that exoskeleton is able to perceive and anticipate the pilot intended motion in real time, thereby decrease the power consumption of pilot and provide most of the strength necessary for human walking. The simulation results demonstrate the feasibility and validity of the proposed control strategy. The exoskeleton can follow the pilot's motion trajectory and minimize the body contact force without the exact dynamic model. |
收录类别 | EI ; CPCI(ISTP) |
产权排序 | 1 |
会议录 | 2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013
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会议录出版者 | IEEE Computer Society |
会议录出版地 | Washington, DC |
语种 | 英语 |
ISBN号 | 978-1-4673-5560-5 |
WOS记录号 | WOS:000335375900136 |
内容类型 | 会议论文 |
源URL | [http://ir.sia.cn/handle/173321/13831] ![]() |
专题 | 沈阳自动化研究所_装备制造技术研究室 |
推荐引用方式 GB/T 7714 | Yang MY,Xu ZG,Liu Y,et al. Perceiving and predicting the intended motion with human-machine interaction force for walking assistive exoskeleton robot[C]. 见:2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013. Takamastu, Japan. August 4-7, 2013. |
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