Kinetics of Copper Dissolution in Liquid Tin by Direct Current

	Kinetics of Copper Dissolution in Liquid Tin by Direct Current
	Sun, Xuemin; Yu, Weiyuan; Wu, Baolei; Yang, Guoqing; Liu, Yun
刊名	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
	2020-10-01
卷号	49 期号:10 页码:3425-3432
关键词	Activation energy Copper Liquids Rate constants Tin Comsol multiphysics Copper dissolution Direct current Dissolution kinetics Dissolution rates Effective charge Immersion method Temperature range
ISSN号	1002185X
英文摘要	The dissolution kinetics of copper in liquid tin in the temperature range of 513~573 K were investigated under the influence of a DC current by immersion method. After dissolution, the dissolution thickness and the thickness of IMC layer at Sn/Cu interface were measured and the dissolution activation energy and effective charge Z* were calculated. The temperature distribution and flow field of the liquid tin caused by the current were simulated by Comsol Multiphysics. It is found that the current has a marked effect on the dissolution rate constant. Correspondingly, the application of the current significantly decreases the activation energy of dissolution. Similarly, the direction of the DC current has an effect on dissolution of copper and the growth of IMC. When the electronic flow is in the direction of dissolution, a further increase in dissolution and a decrease in growth of IMC layer are observed which are attributed to electromigration. When the current density is 240 A/cm2, the effective charge Z* decreases with the increase of temperature. © 2020, Science Press. All right reserved.
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
语种	中文
出版者	Science Press
WOS记录号	WOS:000588490000020
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/150819]
专题	实验室建设与管理处
作者单位	State Key Laboratory of Advanced Processing and Recycling on Non-Ferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Sun, Xuemin,Yu, Weiyuan,Wu, Baolei,et al. Kinetics of Copper Dissolution in Liquid Tin by Direct Current[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2020,49(10):3425-3432.
APA	Sun, Xuemin,Yu, Weiyuan,Wu, Baolei,Yang, Guoqing,&Liu, Yun.(2020).Kinetics of Copper Dissolution in Liquid Tin by Direct Current.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,49(10),3425-3432.
MLA	Sun, Xuemin,et al."Kinetics of Copper Dissolution in Liquid Tin by Direct Current".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 49.10(2020):3425-3432.