Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment

	Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment
	Liu, Yun; Yu, Weiyuan; Wang, Yanhong; Sun, Xuemin
刊名	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
	2020-04-01
卷号	49 期号:4 页码:1402-1408
关键词	Binary alloys Cavitation Dissolution Grain boundaries Intermetallics Tin Ultrasonic equipment Acoustic cavitations Bulk diffusions Formation and evolutions Intermetallic compound growths Intermetallic grains Power dependence Ultrasonic cavitation Ultrasonic treatments
ISSN号	1002185X
英文摘要	The formation and evolution of intermetallic compound (IMC) at the interface of Ni/Sn/Ni with and without ultrasonic wave (USV) were investigated. The results show that without ultrasonic treatment, the IMC layer is plain and compact at the interface of Ni/Ni3Sn4. Towards the solder side, Sn tends to wet and penetrate the grain boundaries to form the scallop-type Ni3Sn4. Moreover, intermetallic grains grow with a 1/2 power dependence on time, and the growth is controlled by the bulk diffusion. With ultrasonic treatment, acoustic cavitation causes the interfacial Ni3Sn4 to dissolve and form many grooves, even forms "neck" connection in the local area of the interfacial IMC. Therefore, the dissolution passage of the Ni atom to the solder is reopened and ultrasonic streaming promotes this dissolution. With the prolonging of ultrasonic time, elongated Ni3Sn4 grains which are of "neck" connection are broken up by the ultrasonic cavitation and fall into the liquid solder. Thus the interfacial IMC is gradually reduced. The Ni3Sn4 grains falling into the liquid are further dissolved and broken by ultrasonic cavitation. Finally, many fine Ni3Sn4 grains are evenly distributed in the joint. © 2020, Science Press. All right reserved
语种	中文
出版者	Science Press
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/115166]
专题	实验室建设与管理处土木工程学院
作者单位	State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Liu, Yun,Yu, Weiyuan,Wang, Yanhong,et al. Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2020,49(4):1402-1408.
APA	Liu, Yun,Yu, Weiyuan,Wang, Yanhong,&Sun, Xuemin.(2020).Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,49(4),1402-1408.
MLA	Liu, Yun,et al."Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 49.4(2020):1402-1408.