Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fatigue Testing

doi:10.3901/CJME.2011.02.187

CORC > 兰州理工大学 > 兰州理工大学

	Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fatigue Testing
	Li Yujia 1; Xuan Fuzhen 1; Li Shuxin 2; Tu Shandong 1
刊名	CHINESE JOURNAL OF MECHANICAL ENGINEERING
	2011-03
卷号	24 期号:2 页码:187-194
关键词	diffusion bonded joints interfacial failure electrical resistance microscopic fatigue testing
ISSN号	1000-9345
DOI	10.3901/CJME.2011.02.187
英文摘要	Micro-structure related behavior of diffusion bonding joints is a crucial issue in device and reactor fabrication of Micro Chemo Mechanical Systems. However, the previous studies have been focused on the macro mechanical performance of diffusion bonded joint, especially diffusion bonding conditions effects on tensile strength, shearing strength and fatigue strength. The research of interfacial micro-voids and microstructures evolution for failure mechanism has not been carried out for diffusion-bonded joints. An interfacial electrical resistance measuring method is proposed to evaluate the quality of bonded joints and verified by using two-dimensional finite-element simulation. The influences of micro void geometry on increments of resistance are analyzed and the relationship between bonded area fraction and resistance increment is established by theoretical analysis combined with simulated results. Metallographic inspections and micro-hardness testing are conducted near the interface of diffusion bonded joints. For the purpose of identifying the failure mechanisms of the joints, both microscopic tensile and fatigue tests are conducted on the self-developed in-situ microscopic fatigue testing system. Based on the microscopic observations, the mechanism of interfacial failure is addressed. The observation result shows that for 316LSS diffusion-bonded joints, microstructure evolution and effect of micro-voids play a key role in interfacial failure mechanism. Finally, a new life prediction model in terms of the increment of electrical resistance is developed and confirmed by the experimental results. The proposed study is initiated that constituted a primary interfacial failure mechanism on micron scale and provide the life prediction for reliability of components sealed by diffusion bonding.
WOS研究方向	Engineering
语种	英语
出版者	EDITORIAL OFFICE CHINESE JOURNAL MECHANICAL ENGINEERING
WOS记录号	WOS:000288685600003
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/35131]
专题	兰州理工大学
作者单位	1.E China Univ Sci & Technol, Key Lab Pressure Syst & Safety, Minist Educ, Shanghai 200237, Peoples R China; 2.Lanzhou Univ Technol, Sch Petrochem Engn, Lanzhou 730050, Peoples R China
推荐引用方式 GB/T 7714	Li Yujia,Xuan Fuzhen,Li Shuxin,et al. Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fatigue Testing[J]. CHINESE JOURNAL OF MECHANICAL ENGINEERING,2011,24(2):187-194.
APA	Li Yujia,Xuan Fuzhen,Li Shuxin,&Tu Shandong.(2011).Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fatigue Testing.CHINESE JOURNAL OF MECHANICAL ENGINEERING,24(2),187-194.
MLA	Li Yujia,et al."Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fatigue Testing".CHINESE JOURNAL OF MECHANICAL ENGINEERING 24.2(2011):187-194.