Morphology and thermal stability of Ti-doped copper nitride films

CORC > 兰州化学物理研究所 > 中国科学院兰州化学物理研究所 > 固体润滑国家重点实验室

	Morphology and thermal stability of Ti-doped copper nitride films
	Fan XY(范晓彦) ; Wu ZG(吴志国) ; Li HJ(李华军) ; Geng BS(耿柏松) ; Li C(李春) ; Yan PX(阎鹏勋)
刊名	JOURNAL OF PHYSICS D: APPLIED PHYSICS
	2007
卷号	40 页码:3430-3435
ISSN号	0022-3727
通讯作者	阎鹏勋
中文摘要	A weakly Ti-doped copper nitride (Cu3N) film was prepared by cylindrical magnetron sputtering. The XPS results indicate that Ti atoms do not substitute for the Cu atoms but probably locate at the grain boundaries. The columnar grains size is about half of that of the undoped Cu3N film and the surface is smoother. For weakly Ti-doped Cu3N films, a dense layer appears on top of the columnar crystals. The RMS of the Cu film formed by annealing of the weakly Ti-doped Cu3N film is more than twice larger than that of the film before annealing. Compared with the undoped Cu3N film, it possesses fine thermal stability both in vacuum and in atmosphere.
学科主题	材料科学与物理化学
收录类别	SCI
资助信息	the Nature Science Foundation of Gansu Province, People’s Republic of China. The project number is ZS021-A25-022-C
语种	英语
WOS记录号	WOS:000246577500026
公开日期	2013-11-01
内容类型	期刊论文
源URL	[http://210.77.64.217/handle/362003/4062]
专题	兰州化学物理研究所_固体润滑国家重点实验室
推荐引用方式 GB/T 7714	Fan XY,Wu ZG,Li HJ,et al. Morphology and thermal stability of Ti-doped copper nitride films[J]. JOURNAL OF PHYSICS D: APPLIED PHYSICS,2007,40:3430-3435.
APA	范晓彦,吴志国,李华军,耿柏松,李春,&阎鹏勋.(2007).Morphology and thermal stability of Ti-doped copper nitride films.JOURNAL OF PHYSICS D: APPLIED PHYSICS,40,3430-3435.
MLA	范晓彦,et al."Morphology and thermal stability of Ti-doped copper nitride films".JOURNAL OF PHYSICS D: APPLIED PHYSICS 40(2007):3430-3435.