Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire

doi:10.1016/j.mssp.2022.106470

CORC > 力学研究所 > 中国科学院力学研究所 > 非线性力学国家重点实验室

	Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire
	Chen, Yue 2,3; Hu, Zhongwei 2,3; Yu, Yiqing 2; Lai, Zhiyuan 2,3; Zhu, Jiegang 2,3; Xu, Xipeng 2,3; Peng, Qing 1
刊名	MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
	2022-05-01
卷号	142 页码:9
关键词	Sapphire Ultrasonic vibration-assisted grinding Surface quality Grinding characteristics
ISSN号	1369-8001
DOI	10.1016/j.mssp.2022.106470
通讯作者	Hu, Zhongwei(huzhongwei@hqu.edu.cn) ; Peng, Qing(PengQing@imech.ac.cn)
英文摘要	Owing to outstanding mechanical, optical, thermal stability and chemical stability properties, sapphire has widespread use in semiconductors, aerospace and other fields. However, it is difficult to machine it efficiently and precisely because of its brittleness and hardness. In this work, the processing and mechanism of machining sapphire using ultrasonic vibration-assisted grinding technology have been investigated via experiment. The machining factors have been analyzed, including the condition of machined surface, specific grinding energy, force and force ratio. Referring to conventional grinding, the application of ultrasonic vibration reduces the force, force ratio, specific energy, and the reduction ratio is direction dependent. The effect on surface roughness and morphology is also anisotropic. Regarding the smoothness of the surface, the suitable directions were axial and tangential, while there was no noticeable improvement in the radial direction. Our results and insights could be beneficial for the precise machining of brittle materials and quality management.
资助项目	National Natural Science Foundation of China[52175404] ; Fujian Province Regional Development Project in 2019[2019H4014] ; State Key Laboratory of Mechanical System and Vibration[MSV202112] ; LiYing Program of the Institute of Mechanics, Chinese Academy of Sciences[E1Z1011001]
WOS关键词	MATERIAL REMOVAL MECHANISM ; STRESS ; EUAG
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
WOS记录号	WOS:000792236100004
资助机构	National Natural Science Foundation of China ; Fujian Province Regional Development Project in 2019 ; State Key Laboratory of Mechanical System and Vibration ; LiYing Program of the Institute of Mechanics, Chinese Academy of Sciences
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/89342]
专题	力学研究所_非线性力学国家重点实验室
通讯作者	Hu, Zhongwei; Peng, Qing
作者单位	1.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China 2.Huaqiao Univ, Inst Mech Engn & Automat, Xiamen 361021, Fujian, Peoples R China 3.Huaqiao Univ, Inst Mfg Engn, Xiamen 361021, Fujian, Peoples R China
推荐引用方式 GB/T 7714	Chen, Yue,Hu, Zhongwei,Yu, Yiqing,et al. Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire[J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,142:9.
APA	Chen, Yue.,Hu, Zhongwei.,Yu, Yiqing.,Lai, Zhiyuan.,Zhu, Jiegang.,...&Peng, Qing.(2022).Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire.MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,142,9.
MLA	Chen, Yue,et al."Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire".MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 142(2022):9.