Research on the technical principle and typical applications of laser shock processing

CORC > 沈阳自动化研究所 > 中国科学院沈阳自动化研究所 > 工艺装备与智能机器人研究室

	Research on the technical principle and typical applications of laser shock processing
	Wu JJ(吴嘉俊)1,2,3; Zhao JB(赵吉宾)1,2,3; Qiao HC(乔红超)2,3; Hu XL(胡宪亮)1,2,3; Yang YQ(杨玉奇)1,2,3
	2020
会议日期	December 15-17, 2020
会议地点	Indore, India
关键词	Laser shock processing Mechanical properties Micro-structure evolution Simple process mechanism Typical applications
页码	722-731
英文摘要	Laser shock processing (LSP) is a novel surface hardening technology, utilizing the stress effect generated by laser-induced plasma shock waves, with the characteristics of better hardening effects, higher processing precision and strong controllability. Nowadays, LSP is widely applied in many fields such as the high-end equipment manufacturing industry. In order to further understand the LSP technology. In this work, the technical principle of LSP is reviewed through basic principle of LSP, enhanced mechanical properties, micro-structure evolution and simple process mechanism. In addition, some typical applications of LSP are introduced briefly from the aspect of aerospace industry, nuclear power industry, biomedical and material forming. This work will provide a theoretical guidance for researchers to further explore the mechanism of LSP and promote to the development of LSP.
产权排序	1
会议录	11th International Conference on Materials Processing and Characterization
会议录出版者	Eslevier
会议录出版地	Amsterdam
语种	英语
ISSN号	2214-7853
WOS记录号	WOS:000645084500027
内容类型	会议论文
源URL	[http://ir.sia.cn/handle/173321/28850]
专题	工艺装备与智能机器人研究室
通讯作者	Wu JJ(吴嘉俊); Zhao JB(赵吉宾)
作者单位	1.University of Chinese, Academy of Sciences, Beijing, 100049, China 2.Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang Liaoninga, 110169, China 3.State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang Liaoning, 110016, China
推荐引用方式 GB/T 7714	Wu JJ,Zhao JB,Qiao HC,et al. Research on the technical principle and typical applications of laser shock processing[C]. 见:. Indore, India. December 15-17, 2020.