Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study

doi:10.1016/j.apsusc.2021.151575

	Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study
	Zhu, Tongtong 2,3; Luo, Didi 3; Wu, Andong 2,3; Tan, Teng 2,3; Guo, Hao 3; Xiong, Pingran 3; Lin, Zeqiang 2,3; Huang, Shichun 3; Chu, Qingwei 3; Yang, Ziqin 3
刊名	APPLIED SURFACE SCIENCE
	2022-02-01
卷号	574 页码:10
关键词	SRF cavities Plasma processing Self-consistent model Sputtering-yield probability distribution IEDF
ISSN号	0169-4332
DOI	10.1016/j.apsusc.2021.151575
通讯作者	Wu, Andong(antonwoo@impcas.ac.cn) ; Tan, Teng(ttan@impcas.ac.cn)
英文摘要	Plasma processing is a fast-emerging surface treatment technology for superconducting radio frequency (SRF) cavities: plasma interacts with the impurity contamination and tiny burrs, resulting in an etched clean-andsmooth RF surface. Among all the variations of plasma processing method, the physical sputtering process might be applied to SRF cavities but has no clear etching profile (including distribution uniformity, ion flux, energy, and etching rate). To investigate that, this paper utilizes a two-dimensional self-consistent model combining the fluid equations and the Monte Carlo collision method. With the model, we introduced the sputtering-yield probability distribution to evaluate the physical sputtering process quantitatively; optimized the plasma distribution characteristics with three electrode structures to attain uniformly distributed plasma; built the correlation between ion flux and ion-energy distribution function (IEDF) under varied power and frequency; and studied the physical sputtering process at different positions. In the end, we performed the plasma physical sputtering experiment on small niobium samples, seeing an etching and smoothing effect. This research successfully evaluated the physical sputtering process for SRF cavities, and indicated the feasibility of pure physical sputtering etching.
资助项目	National Natural Science Foundation of China[12105335] ; Sichuan Science and Technology Program[2020YFSY000] ; Scientific Instrument Development Project of Chinese Academy of Sciences[E028861Y]
WOS关键词	CROSS-SECTIONS ; IMPACT ; ARGON
WOS研究方向	Chemistry ; Materials Science ; Physics
语种	英语
出版者	ELSEVIER
WOS记录号	WOS:000729147900003
资助机构	National Natural Science Foundation of China ; Sichuan Science and Technology Program ; Scientific Instrument Development Project of Chinese Academy of Sciences
内容类型	期刊论文
源URL	[http://119.78.100.186/handle/113462/140105]
专题	中国科学院近代物理研究所
通讯作者	Wu, Andong; Tan, Teng
作者单位	1.Sichuan Univ, Inst Nucl Sci & Technol, Chengdu 610064, Peoples R China 2.Univ Chinese Acad Sci, Sch Nucl Sci & Technol, Beijing 100049, Peoples R China 3.Chinese Acad Sci, Inst Modern Phys, Lanzhou 730000, Peoples R China
推荐引用方式 GB/T 7714	Zhu, Tongtong,Luo, Didi,Wu, Andong,et al. Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study[J]. APPLIED SURFACE SCIENCE,2022,574:10.
APA	Zhu, Tongtong.,Luo, Didi.,Wu, Andong.,Tan, Teng.,Guo, Hao.,...&He, Yuan.(2022).Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study.APPLIED SURFACE SCIENCE,574,10.
MLA	Zhu, Tongtong,et al."Applying the plasma physical sputtering process to SRF cavity treatment: Simulation and Experiment Study".APPLIED SURFACE SCIENCE 574(2022):10.