A Novel Nanoimprint Lithography Thiol-ene Resist for Sub-70 nm Nanostructures

doi:10.1166/sam.2020.3721

	A Novel Nanoimprint Lithography Thiol-ene Resist for Sub-70 nm Nanostructures
	Zhang, Man 2,3; Xia, Liang-Ping 1,3; Dang, Sui-Hu 3; Cao, A-Xiu 2; Deng, Qi-Ling 2; Du, Chun-Lei 1,3
刊名	SCIENCE OF ADVANCED MATERIALS
	2020-06-01
卷号	12 期号:6 页码:779-783
关键词	Thiol-ene Copolymers Nanoimprint Lithography Resist Young's Modulus Surface Energy
ISSN号	1947-2935
DOI	10.1166/sam.2020.3721
通讯作者	Zhang, Man(zhangman881003@126.com)
英文摘要	In this paper, we propose a novel kind of UV click-polymerization thiol-ene copolymers as nanoimprint lithography resists for sub-70 nm resolution patterns. High-precision mold imprint and release are two of the most critical steps of nanoimprint lithography, which requires the resists with properties of excellent conformal replication and low surface energy. Conventional UV-curable resists used in nanoimprint lithography, such as acrylate, epoxy resin, and vinyl ether, cannot satisfy all these properties requirements because they exhibit surface oxygen inhibition during polymerization, or materials fracture and delamination during mold releasing. A novel kind of thiol-ene copolymers have been investigated in this study, which have many properties favorable for use as nanoimprint lithography resists to imprint sub-70 nm and high-aspect-ratio nanostructures. These properties include sufficiently low viscosity and high Young's modulus, low surface energy for easy demolding, polymerization in benign ambient, and in particular, high chemical-etch resistance. These excellent properties give improve nanoimprinting results.
资助项目	National Natural Science Foundation of China (NSFC)[51703227] ; National Natural Science Foundation of China (NSFC)[C0025053] ; National Natural Science Foundation of China (NSFC)[61775213] ; National Natural Science Foundation of China (NSFC)[61605211] ; National Natural Science Foundation of China (NSFC)[61504147] ; Sichuan Science and Technology Program[2017RZ0031] ; Sichuan Science and Technology Program[2019YJ0014] ; Instrument Development of Chinese Academy of Sciences ; National R&D Program of China[2017YFC0804900] ; Youth Innovation Promotion Association of Chinese Academy of Sciences
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Physics
语种	英语
出版者	AMER SCIENTIFIC PUBLISHERS
WOS记录号	WOS:000522735300001
内容类型	期刊论文
源URL	[http://119.78.100.138/handle/2HOD01W0/10755]
专题	中国科学院重庆绿色智能技术研究院
通讯作者	Zhang, Man
作者单位	1.Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing Key Lab Multiscale Mfg Technol, Chongqing 400714, Peoples R China 2.Chinese Acad Sci, Inst Opt & Elect, Chengdu 610209, Peoples R China 3.Yangtze Normal Univ, Sch Elect Informat Engn, Chongqing 408100, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Man,Xia, Liang-Ping,Dang, Sui-Hu,et al. A Novel Nanoimprint Lithography Thiol-ene Resist for Sub-70 nm Nanostructures[J]. SCIENCE OF ADVANCED MATERIALS,2020,12(6):779-783.
APA	Zhang, Man,Xia, Liang-Ping,Dang, Sui-Hu,Cao, A-Xiu,Deng, Qi-Ling,&Du, Chun-Lei.(2020).A Novel Nanoimprint Lithography Thiol-ene Resist for Sub-70 nm Nanostructures.SCIENCE OF ADVANCED MATERIALS,12(6),779-783.
MLA	Zhang, Man,et al."A Novel Nanoimprint Lithography Thiol-ene Resist for Sub-70 nm Nanostructures".SCIENCE OF ADVANCED MATERIALS 12.6(2020):779-783.