Highly solderability of FeP film in contact with SnAgCu solder

doi:10.1016/j.jallcom.2019.152900

CORC > 金属研究所 > 中国科学院金属研究所

	Highly solderability of FeP film in contact with SnAgCu solder
	Zhou, Haifei 2; Guo, Jingdong 1; Shang, Jianku 3; Song, Xiaoning 2
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2020-03-25
卷号	818 页码:6
关键词	Solderability Electroless FeP SnAgCu Oxidation
ISSN号	0925-8388
DOI	10.1016/j.jallcom.2019.152900
通讯作者	Guo, Jingdong(jdguo@imr.ac.cn) ; Shang, Jianku(jkshang@illinois.edu)
英文摘要	New under bump metallization (UBM) is required for future microelectronics to minimize reliability concerns with solder interconnects. In this study, electroless FeP film was prepared as UBM. Solderability of electroless NiP, electrodeposite Fe and electroless FeP films with eutectic SnAgCu solder was investigated by static wetting tests and wetting balance measurements. Results revealed that the solderability of NiP film has almost no change with thermal aged for the film in air atmosphere increasing. The contact angles for FeP and Fe films with SnAgCu solder increased and the maximum wetting force decreased with heating time increasing from 0 h, 48 h, 89 h-160 h at 180 degrees C. But the solderability of FeP film was found to be better than those of NiP and Fe whether the films in base or thermal aged at 180 degrees C for 89 h. Even after thermal aged in air atmosphere at 180 degrees C for 160 h, the FeP also performed the smallest contace angle compared with the NiP and the Fe. Oxide layer on the surface of FeP was much easier to be removed by rosin mildly activated flux during reflow process because loose structure. It was proved to be the key for the highly solderability of electroless FeP. (C) 2019 Elsevier B.V. All rights reserved.
资助项目	State Grid Scientific and Technological Research Program of China[5211DS17001X]
WOS研究方向	Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	ELSEVIER SCIENCE SA
WOS记录号	WOS:000506166900072
资助机构	State Grid Scientific and Technological Research Program of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/136329]
专题	金属研究所_中国科学院金属研究所
通讯作者	Guo, Jingdong; Shang, Jianku
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Zhejiang Elect Power Corp Res Inst, Hangzhou 310014, Peoples R China 3.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Zhou, Haifei,Guo, Jingdong,Shang, Jianku,et al. Highly solderability of FeP film in contact with SnAgCu solder[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,818:6.
APA	Zhou, Haifei,Guo, Jingdong,Shang, Jianku,&Song, Xiaoning.(2020).Highly solderability of FeP film in contact with SnAgCu solder.JOURNAL OF ALLOYS AND COMPOUNDS,818,6.
MLA	Zhou, Haifei,et al."Highly solderability of FeP film in contact with SnAgCu solder".JOURNAL OF ALLOYS AND COMPOUNDS 818(2020):6.