The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

doi:10.1016/j.surfcoat.2018.09.086

CORC > 金属研究所 > 中国科学院金属研究所

	The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy
	Ong, Chun Yee Aaron 1; Blackwood, Daniel John 1; Li, Yi 2
刊名	SURFACE & COATINGS TECHNOLOGY
	2019-01-15
卷号	357 页码:23-27
关键词	Nickel-tungsten Hall-Petch effect Electrodeposition Nanocrystalline metal Nickel alloys
ISSN号	0257-8972
DOI	10.1016/j.surfcoat.2018.09.086
通讯作者	Ong, Chun Yee Aaron(mseocya@nus.edu.sg)
英文摘要	Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with < 13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.
资助项目	National Natural Science Foundation of China[51471165]
WOS研究方向	Materials Science ; Physics
语种	英语
出版者	ELSEVIER SCIENCE SA
WOS记录号	WOS:000455691100003
资助机构	National Natural Science Foundation of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/131465]
专题	金属研究所_中国科学院金属研究所
通讯作者	Ong, Chun Yee Aaron
作者单位	1.Natl Univ Singapore, Dept Mat Sci & Engn, Blk EA 03-09,9 Engn Dr 1, Singapore 117575, Singapore 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China
推荐引用方式 GB/T 7714	Ong, Chun Yee Aaron,Blackwood, Daniel John,Li, Yi. The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy[J]. SURFACE & COATINGS TECHNOLOGY,2019,357:23-27.
APA	Ong, Chun Yee Aaron,Blackwood, Daniel John,&Li, Yi.(2019).The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy.SURFACE & COATINGS TECHNOLOGY,357,23-27.
MLA	Ong, Chun Yee Aaron,et al."The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy".SURFACE & COATINGS TECHNOLOGY 357(2019):23-27.