Recrystallization of Ni base superalloy DZ4

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	Recrystallization of Ni base superalloy DZ4
	Wang, DL ; Li, JB ; Jin, T ; Yang, SQ ; Wei, Z ; Hu, ZQ ; Fu, LQ
刊名	ACTA METALLURGICA SINICA
	2006-02-11
卷号	42 期号:2 页码:167-171
关键词	Ni base alloy DZ4 shot peening recrystallization
ISSN号	0412-1961
通讯作者	Wang, DL(wdltx@163.com)
英文摘要	The recrystallizations behavior of shot peening samples of Ni base superalloy DZ4 both at lower temperature in the gamma+gamma' field as well as during solution treatment were studied by SEM and XRD. The results show that the shot peening layer starts recrystallizing at 1000 degrees C for 2 h. When the alloy was treated at the temperature lower than that of gamma' phase dissolved completely, the cellular recrystallization was observed, and recrystallization occurred through the growth of recrystallized grain when the alloy was treated at solution temperature. The gamma' phase can retard the migration of recrystallizing grain boundary. The heat treat temperature has more influence on recrystallization rate and layer thickness than the holding time. By metallographic examination of the tensile samples at 1220 degrees C for 2 h, the recrystallized grains already formed after a small plastic deformation of about 0.9%. Recrystallized grains always nucleated preferably at the surface of tensile samples.
WOS研究方向	Metallurgy & Metallurgical Engineering
语种	英语
出版者	SCIENCE PRESS
WOS记录号	WOS:000235929000012
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/86517]
专题	金属研究所_中国科学院金属研究所
通讯作者	Wang, DL
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Shenyang Liming Aero Engine Grp Corp Ltd, Shenyang 110043, Peoples R China
推荐引用方式 GB/T 7714	Wang, DL,Li, JB,Jin, T,et al. Recrystallization of Ni base superalloy DZ4[J]. ACTA METALLURGICA SINICA,2006,42(2):167-171.
APA	Wang, DL.,Li, JB.,Jin, T.,Yang, SQ.,Wei, Z.,...&Fu, LQ.(2006).Recrystallization of Ni base superalloy DZ4.ACTA METALLURGICA SINICA,42(2),167-171.
MLA	Wang, DL,et al."Recrystallization of Ni base superalloy DZ4".ACTA METALLURGICA SINICA 42.2(2006):167-171.