Preparation of semiconductor laser element
OOSAKA SHIGEO; FUJIWARA KANJI; FUJIWARA TAKAO
1981-04-16
著作权人FUJITSU LTD
专利号JP1981040291A
国家日本
文献子类发明申请
其他题名Preparation of semiconductor laser element
英文摘要PURPOSE:To obtain an excellent resonator by forming a plurality of stripe-shaped light-emitting regions in a semiconductor wafer, providing on the wefer surface corresponding to them stripe-shaped electrodes continuous over the upper surface of each element, and cutting the wafer in the direction perpendicular to the electrodes in order to use the cut surfaces as resonance surfaces. CONSTITUTION:On an N type GaAs substrate 1; an N type GaAlAs clad layer 2, P type GaAs active layer 3, P type GaAlAs clad layer 4 and N type GaAlAs cap layer 5 are successively grown by the liquid phase epitaxy. In the layer 5, a plurality of P type stripe-shaped light-emitting regions 8 extending into the layer 4 are produced at given intervals by diffusion, and continuous stripe-shaped electrodes 9 of Au or the like are provided on the regions 8. After that, scribe lines 11 are made perpendicularly to the electrodes 9, and a pressure is applied to the lower surface of this to separate it into pellets. This prevents the cuts due to the scribing from reaching the substrate Therfore, the cut surfaces to be used as resonance surfaces 16 are clean, so that an excellent resonator are obtained.
公开日期1981-04-16
申请日期1979-09-10
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/89827]  
专题半导体激光器专利数据库
作者单位FUJITSU LTD
推荐引用方式
GB/T 7714
OOSAKA SHIGEO,FUJIWARA KANJI,FUJIWARA TAKAO. Preparation of semiconductor laser element. JP1981040291A. 1981-04-16.
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