Semiconductor light-emission device
TAKANO SHINJI
1992-09-14
著作权人NEC CORP
专利号JP1992258190A
国家日本
文献子类发明申请
其他题名Semiconductor light-emission device
英文摘要PURPOSE:To realize higher output and higher efficiency of a semiconductor laser with suppressed leak current by a method wherein a low conductivity ratio semiconductor layer is formed on a current strangulation layer. CONSTITUTION:A V-shaped groove is formed with etching liquid consisting of a solution of hydrochloric acid and phosphoric acid. The width of the groove is approx. 5mum an the depth is approx. 2mum. After that, a p-In clad layer 50, an undoped InGaAs active layer 60, an n-InP layer 70, and an n-InGaAa contact layer 80 are grown. This semiconductor laser wafer is cleaved to a length for a 800mum resonator to obtain a semiconductor laser.
公开日期1992-09-14
申请日期1991-02-13
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/89067]  
专题半导体激光器专利数据库
作者单位NEC CORP
推荐引用方式
GB/T 7714
TAKANO SHINJI. Semiconductor light-emission device. JP1992258190A. 1992-09-14.
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