Production of semiconductor light emitting apparatus
ISSHIKI KUNIHIKO
1992-05-12
著作权人MITSUBISHI ELECTRIC CORP
专利号JP1992137781A
国家日本
文献子类发明申请
其他题名Production of semiconductor light emitting apparatus
英文摘要PURPOSE:To improve reproducibility of good characteristic through formation of a current path matching with bending active region with high precision by comparatively simple structure by forming an ion injection mask at the groove position just above the active stripe on the self-aligning basis. CONSTITUTION:After a striped groove is formed on an N type GaAs substrate 11, AlGaAs multilayer films 12 to 15 having the bending area 16 corresponding to the groove of substrate are grown. Next, the flat resist surface is obtained by coating the wafer surface with a photoresist 3. Next, the photoresist 3 is partially removed so that the protruding area of wafer is exposed and the interior of groove is filled with the resist. Next, using the photoresist 3 as the mask, proton is injected to the entire surface of wafer to give a high resistance to the region 5, which will operate as the active region, other than the bending area. Therefore, a problem that element characteristic is fluctuated due to fluctuation of positioning can be eliminated.
公开日期1992-05-12
申请日期1990-09-28
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/88175]  
专题半导体激光器专利数据库
作者单位MITSUBISHI ELECTRIC CORP
推荐引用方式
GB/T 7714
ISSHIKI KUNIHIKO. Production of semiconductor light emitting apparatus. JP1992137781A. 1992-05-12.
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