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	Method of assembling vcsel chips on a sub-mount
	PRUIJMBOOM, ARMAND; DUMOULIN, RAIMOND LOUIS; MILLER, MICHAEL
	2014-11-27
著作权人	KONINKLIJKE PHILIPS ELECTRONICS N V
专利号	US20140348192A1
国家	美国
文献子类	发明申请
其他题名	Method of assembling vcsel chips on a sub-mount
英文摘要	The present invention relates to a method of assembling VCSEL chips (1) on a sub-mount (2). A de-wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub-mount (2). A further de-wetting layer (13) is deposited on a connecting side of the sub-mount (2) which is to be connected to the VCSEL chips (1). The de-wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub-mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub-mount (2) and soldered to the sub-mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub-mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub-mount (2) is achieved without time consuming measures.
公开日期	2014-11-27
申请日期	2012-10-08
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/86182]
专题	半导体激光器专利数据库
作者单位	KONINKLIJKE PHILIPS ELECTRONICS N V
推荐引用方式 GB/T 7714	PRUIJMBOOM, ARMAND,DUMOULIN, RAIMOND LOUIS,MILLER, MICHAEL. Method of assembling vcsel chips on a sub-mount. US20140348192A1. 2014-11-27.

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