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	Manufacture of chip of semiconductor laser
	TANAKA HARUO; MUSHIGAMI MASAHITO; MURANISHI MASAYOSHI
	1985-08-28
著作权人	ROHM KK
专利号	JP1985165779A
国家	日本
文献子类	发明申请
其他题名	Manufacture of chip of semiconductor laser
英文摘要	PURPOSE:To improve the productivity by performing a series of cleaving, finely scribing, coating an oxidation preventive film, and sorting chips at every wafer unit by using an adhesive sheet. CONSTITUTION:A material wafer 1 of a semiconductor laser is coated in advance on the upper surface of an alkali soluble positive resist. A scribing scratch 7 for cleavage starting point is formed on the wafer Then, the wafer 1 is cleaved with the scratches 7 as starting points by applying a pressure from the outer surface, and small wafer pieces 11 are bonded in parallel. Then, the oxidation preventive film such as Si3N4, Si, SiO2 or Al2O3 is coated on the exposed portion of the piece 1 Then, the sheet 8 is held on a movable table 16, the group 11 is finely scribed at the scribing lines 8, thereby obtaining chip group aligned laterally and longitudinally. Then, the sheet 8 is elongated, and the bonded chips are separated. Then, the positive resist is dissolved and removed, the oxidation preventive portion of the upper layer is removed, washed with water and dried.
公开日期	1985-08-28
申请日期	1984-02-07
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/85205]
专题	半导体激光器专利数据库
作者单位	ROHM KK
推荐引用方式 GB/T 7714	TANAKA HARUO,MUSHIGAMI MASAHITO,MURANISHI MASAYOSHI. Manufacture of chip of semiconductor laser. JP1985165779A. 1985-08-28.

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