半導体レーザの製造方法
岡村 茂; 田口 孝雄; 和田 修
1994-10-12
著作权人FUJITSU LTD
专利号JP1994080858B2
国家日本
文献子类授权发明
其他题名半導体レーザの製造方法
英文摘要PURPOSE:To form a vertical and smooth laser resonator surface easily by shap ing an end surface through chemical etching first, irradiating the end surface by focused ion beams and finishing the end surface when the end surface of a Fabry-Perot type resonator is shaped. CONSTITUTION:A striped section 2 is formed to a wafer 1, into which a semiconductor laser, etc. consisting of an AlGaAs/GaAs group, etc. are manufactured, by using a photo-resist mask film 4 through a photo-lithography and chemical etching. Since sags are generated in the end surfaces 3 of the shaped striped section 2, the vertical and smooth end surfaces 3 are formed through the projection of Ga ion beams 5 as focused ion beams. Both end surfaces 3 are processed completely by ion beams 5, and damages due to processing are removed perfectly through heat treatment for approximately ten min at 500 deg.C. Accordingly, an excellent semiconductor laser, approximately 20mA oscillation threshold currents therefor may be used, is otained with superior reproducibility without depending upon a cleavage method.
公开日期1994-10-12
申请日期1984-11-20
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/80791]  
专题半导体激光器专利数据库
作者单位FUJITSU LTD
推荐引用方式
GB/T 7714
岡村 茂,田口 孝雄,和田 修. 半導体レーザの製造方法. JP1994080858B2. 1994-10-12.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace