Semiconductor laser device | |
ITSUSHIKI KUNIHIKO | |
1985-05-15 | |
著作权人 | MITSUBISHI DENKI KK |
专利号 | JP1985085588A |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Semiconductor laser device |
英文摘要 | PURPOSE:To ensure high geographical accuracy and easy assembly by a method wherein residual stress after an assembly process is mitigated by integrating a submount and a monitoring photoreceiving element into a single body. CONSTITUTION:Portions of an N layer 6c and Si substrate 6a supporting a semiconductor laser chip 1 mitigate the stress generated on the chip 1 by a heat- radiating block 3, and serve as a submount. The surface of the layer 6c facing the cleavage plane of the chip 1 functions as the photoreceiving plane of a photoreceiving element. The photoreceiving element is so constructed that photoelectric current generated across the P-N junction produced along the area between the layer 6c anc P type epitaxial layer 6b is detected at a terminal connected to an electrode 6f and to the block 3. In such a construction, the submount 6 and a photoreceiving element can easily be unified into a single body. |
公开日期 | 1985-05-15 |
申请日期 | 1983-10-17 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/79280] |
专题 | 半导体激光器专利数据库 |
作者单位 | MITSUBISHI DENKI KK |
推荐引用方式 GB/T 7714 | ITSUSHIKI KUNIHIKO. Semiconductor laser device. JP1985085588A. 1985-05-15. |
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