半導体レーザ装置
渡辺 幸雄; 岡島 正季; 波多腰 玄一
1999-04-02
著作权人株式会社東芝
专利号JP2908480B2
国家日本
文献子类授权发明
其他题名半導体レーザ装置
英文摘要PURPOSE:To eliminate difficulties and complexities in control of a laser manufacturing process and to decrease a forward voltage and a series resistance by a method wherein an intermediate band gap layer is formed of GaAlAs instead of InGaP which is used in a conventional one. CONSTITUTION:An n-In0.5(Ga0.3Al0.7)0.5P clad layer 12, an InGaP active layer 13, a p-In0.5(Ga0.3Al0.7)0.5P clad layer 14, and a p-Ga0.4Al0.6As intermediate contact layer 15 are grown on an n-GaAs substrate 1 to form a double-hetero structure. The p-Ga0.4Al0.6As intermediate contact layer 15 and the p-In0.5(Ga0.3Al0.7)0.5P clad layer 14 are etched up to a halfway point of the layer 14 with hot phosphoric acid using an SiO2 film 18 as a mask to form a stripe-like mesa 19. At this point, the etching rate of a p-Ga0.4Al0.6As intermediate contact layer to hot phosphoric acid is made equal or so to that of a p-In0.5(Ga0.3Al0.7)0.5P clad layer.
公开日期1999-06-21
申请日期1989-09-29
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/78443]  
专题半导体激光器专利数据库
作者单位株式会社東芝
推荐引用方式
GB/T 7714
渡辺 幸雄,岡島 正季,波多腰 玄一. 半導体レーザ装置. JP2908480B2. 1999-04-02.
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