Manufacture of semiconductor laser device | |
YAGI TETSUYA | |
1988-09-29 | |
著作权人 | MITSUBISHI ELECTRIC CORP |
专利号 | JP1988233589A |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Manufacture of semiconductor laser device |
英文摘要 | PURPOSE:To simplify the manufacturing process, by growing a current blocking layer on a first contact layer and a second clad layer, thereafter growing a second contact layer on the current blocking layer, and embedding both sides of the plane (111) A of a ridge part. CONSTITUTION:A first clad layer 2, an active layer 3, a second clad layer 4, a third clad layer 15 and a first contact layer 16 are sequentially grown on a semiconductor substrate Thereafter, the first contact layer 16 and the third clad layer 15 are selectively removed. A ridge part 17 having a plane (111) A is formed on both side surfaces thereof. A current blocking layer 18 is grown on the first contact layer 16 and the second clad layer 4 so that the layer 18 is not directly grown on the plane (111) A but separated. Thereafter, a second contact layer 19 is grown on the current blocking layer 19, and both sides of the of the plane (111) A of the ridge part 17 are embedded. |
公开日期 | 1988-09-29 |
申请日期 | 1987-03-23 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/74884] |
专题 | 半导体激光器专利数据库 |
作者单位 | MITSUBISHI ELECTRIC CORP |
推荐引用方式 GB/T 7714 | YAGI TETSUYA. Manufacture of semiconductor laser device. JP1988233589A. 1988-09-29. |
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