Manufacture of semiconductor laser device
YAGI TETSUYA
1988-09-29
著作权人MITSUBISHI ELECTRIC CORP
专利号JP1988233589A
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor laser device
英文摘要PURPOSE:To simplify the manufacturing process, by growing a current blocking layer on a first contact layer and a second clad layer, thereafter growing a second contact layer on the current blocking layer, and embedding both sides of the plane (111) A of a ridge part. CONSTITUTION:A first clad layer 2, an active layer 3, a second clad layer 4, a third clad layer 15 and a first contact layer 16 are sequentially grown on a semiconductor substrate Thereafter, the first contact layer 16 and the third clad layer 15 are selectively removed. A ridge part 17 having a plane (111) A is formed on both side surfaces thereof. A current blocking layer 18 is grown on the first contact layer 16 and the second clad layer 4 so that the layer 18 is not directly grown on the plane (111) A but separated. Thereafter, a second contact layer 19 is grown on the current blocking layer 19, and both sides of the of the plane (111) A of the ridge part 17 are embedded.
公开日期1988-09-29
申请日期1987-03-23
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/74884]  
专题半导体激光器专利数据库
作者单位MITSUBISHI ELECTRIC CORP
推荐引用方式
GB/T 7714
YAGI TETSUYA. Manufacture of semiconductor laser device. JP1988233589A. 1988-09-29.
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