| Photoelectric device and manufacture thereof | |
| TAGUCHI HIDEO | |
| 1992-11-06 | |
| 著作权人 | HITACHI LTD |
| 专利号 | JP1992315486A |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Photoelectric device and manufacture thereof |
| 英文摘要 | PURPOSE:To prevent damage of the main surface of a submount in which a semiconductor laser chip secured and to prevent the flow-out of solder to be used to secure the chip and the submount. CONSTITUTION:A bonding tool contact surface 31 which is lower by one step than the main surface of a submount 2, is provided, and damage of the main surface of the submount is prevented by inhibiting to bring the tool 32 into contact with the main surface of the submount. A cutout 30 formed along an edge is provided at front and rear edges of the front end of the submount to be superposed with the front end of a semiconductor laser chip 1, and solders 4, 6 having flown out at the time of securing are contained in a space recessed by the cutout flow-out of the solders. |
| 公开日期 | 1992-11-06 |
| 申请日期 | 1991-04-15 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/71051]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI LTD |
| 推荐引用方式 GB/T 7714 | TAGUCHI HIDEO. Photoelectric device and manufacture thereof. JP1992315486A. 1992-11-06. |
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