Manufacture of semiconductor laser device
HAYASHI HIROSHI; YAMAMOTO OSAMU; MIYAUCHI NOBUYUKI; YAMAMOTO SABURO
1987-06-19
著作权人SHARP CORP
专利号JP1987136893A
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor laser device
英文摘要PURPOSE:To facilitate manufacture of an internal reflection interference type semiconductor laser device which has a stable vertical mode with an improved yield by a method wherein marks are provided on one main surface of a semiconductor laser wafer corresponding to the position in which an internal reflective region exists. CONSTITUTION:Ohmic electrodes 5 and 6 made of electrode metal are provided on both surfaces of an element which has an internal reflective region 3 and an Al electrode 7 for lead bonding is provided on the top surface. Roughly triangle-shape marks 8 and 9 are provided on the Al electrode 7 at the positions corresponding to the internal reflective region 3. In the process by which a semiconductor laser wafer is divided into bar-shape or chip-shape semiconductor laser elements, the marks 8 and 9 can be a reference for determining an external resonator length. Therefore, the external resonator length can be set with a high accuracy.
公开日期1987-06-19
申请日期1985-12-10
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/70673]  
专题半导体激光器专利数据库
作者单位SHARP CORP
推荐引用方式
GB/T 7714
HAYASHI HIROSHI,YAMAMOTO OSAMU,MIYAUCHI NOBUYUKI,et al. Manufacture of semiconductor laser device. JP1987136893A. 1987-06-19.
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