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	Semiconductor laser device
	NAGAI SEIICHI
	1991-04-02
著作权人	MITSUBISHI ELECTRIC CORP
专利号	JP1991076033A
国家	日本
文献子类	发明申请
其他题名	Semiconductor laser device
英文摘要	PURPOSE:To simplify the assembly process of a laser diode, to miniaturize the pickup, and also, to reduce the position adjustment of the laser device by using a surface light emission type laser diode, and forming a monitoring photodiode and a signal reproducing photodiode in the same plane of a submount. CONSTITUTION:A monitoring photodiode (PD) 4 and a signal reproducing PD 14 are formed in the same plane of a submount 2, a surface light emission type laser diode (LD) 17 is assembled on the submount 2, a mirror 16 is installed on the monitoring PD 4 and the signal reproducing PD 14, and a beam splitter 10 is installed on the surface light emission type LD 17. That is, the LD 17, the monitoring PD 4 and the signal reproducing PD 14 are placed on the parallel surface. In such a way, die bonding and wire bonding can be simplified, and since the monitoring PD 4 and the signal reproducing PD 14 can be formed in the submount 2 by using a photoplate technique, the device has high positioning accuracy, and an adjustment at the time of assembly of a pickup can be decreased, and also, it can be miniaturized.
公开日期	1991-04-02
申请日期	1989-08-17
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/69066]
专题	半导体激光器专利数据库
作者单位	MITSUBISHI ELECTRIC CORP
推荐引用方式 GB/T 7714	NAGAI SEIICHI. Semiconductor laser device. JP1991076033A. 1991-04-02.

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