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	Passive alignment microstructures for electroptical devices
	THOMAS, AMMER; MICHAEL, THOMAS, GALE
	2003-02-05
著作权人	CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE S.A
专利号	GB2378316A
国家	英国
文献子类	发明申请
其他题名	Passive alignment microstructures for electroptical devices
英文摘要	Alignment grooves or openings are formed by exposing and developing a photoresist layer formed over a substrate. The edges of the alignment features are rounded by subjecting the photoresist layer to an extended bake at elevated temperature which causes the photoresist to reflow. The rounded edges facilitate the mounting of optoelectronic components such as optical fibres and VCSELs on to the substrate in alignment with the openings or grooves of the photoresist pattern. Alternatively, the photoresist pattern with the rounded edges may be used as a master pattern for a replication mould, and alignment features may be formed by moulding sol-gel or UV curable polymer materials.
公开日期	2003-02-05
申请日期	2001-07-30
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/66820]
专题	半导体激光器专利数据库
作者单位	CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE S.A
推荐引用方式 GB/T 7714	THOMAS, AMMER,MICHAEL, THOMAS, GALE. Passive alignment microstructures for electroptical devices. GB2378316A. 2003-02-05.

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