QQ客服 官方微博 反馈留言

	Hermetic chip-scale package for photonic devices
	JOHNSON, KLEIN, L.
	2002-04-03
著作权人	FINISAR CORPORATION
专利号	EP1192669A1
国家	欧洲专利局
文献子类	发明申请
其他题名	Hermetic chip-scale package for photonic devices
英文摘要	A package having one or more integrated circuit photonic devices in a hermetically sealed enclosure. The photonic devices may be sources or detectors of light. The sealed enclosure consists of a transparent window attached to a first level housing. The transparent window contains patterned electrically conductive traces for purposes of routing electrical signals to and from semiconductor chip, which is bonded to patterned window. A second level housing is attached to the first level housing, and aligned via mechanical features incorporated with the transparent window. The second level housing provides a receptacle for a plug having light waveguides or optical fibers that are aligned with the photonic devices when inserted into the receptacle. One or more pins are inserted through the plug and the second level housing to secure the plug in the receptacle to the hermetically sealed photonic devices, such as VCSEL's on an integrated circuit semiconductor.
公开日期	2002-04-03
申请日期	2000-06-29
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/65472]
专题	半导体激光器专利数据库
作者单位	FINISAR CORPORATION
推荐引用方式 GB/T 7714	JOHNSON, KLEIN, L.. Hermetic chip-scale package for photonic devices. EP1192669A1. 2002-04-03.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。