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	Method of fabricating optoelectronic devices directly attached to silicon-based integrated circuits
	LOTT, JAMES A.; LEDENTSOV, NIKOLAI; SHCHUKIN, VITALY
	2013-05-16
著作权人	CONNECTOR OPTICS LLC
专利号	US20130122617A1
国家	美国
文献子类	发明申请
其他题名	Method of fabricating optoelectronic devices directly attached to silicon-based integrated circuits
英文摘要	Hybrid integration of vertical cavity surface emitting lasers (VCSELs) and/or other optical device components with silicon-based integrated circuits. A multitude of individual VCSELs or optical devices are processed on the surface of a compound semiconductor wafer and then transferred to a silicon-based integrated circuit. A sacrificial separation layer is employed between the optical components and the mother semiconductor substrate. The transfer of the optical components to a carrier substrate is followed by the elimination of the sacrificial or separation layer and simultaneous removal of the mother substrate. This is followed by the attachment and interconnection of the optical components to the surface of, or embedded within the upper layers of, an integrated circuit, followed by the release of the components from the carrier substrate.
公开日期	2013-05-16
申请日期	2012-10-09
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/64949]
专题	半导体激光器专利数据库
作者单位	CONNECTOR OPTICS LLC
推荐引用方式 GB/T 7714	LOTT, JAMES A.,LEDENTSOV, NIKOLAI,SHCHUKIN, VITALY. Method of fabricating optoelectronic devices directly attached to silicon-based integrated circuits. US20130122617A1. 2013-05-16.

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