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	Semiconductor laser assembly with built-in electronic cooling element
	GOTO MASAMI
	1990-08-03
著作权人	FUJITSU LTD
专利号	JP1990197185A
国家	日本
文献子类	发明申请
其他题名	Semiconductor laser assembly with built-in electronic cooling element
英文摘要	PURPOSE:To enable the high speed drive of a semiconductor laser keeping the reduction minimum in temperature difference between two faces of an element by a method wherein a high electric conductor where an LD chip is mounted is directly fixed to a metal case. CONSTITUTION:An LD chip 21 is mounted on end fixed to a stem 31 formed of a material which is high in electric conductivity and low in thermal conductivity. The stem 31 is extended to be directly connected and fixed to the inner face of a metal case 27. A high frequency board 32, on which an electric signal transmitting pattern is formed, is pasted on the stem 3 And, the stem 31 is mounted on a Peltier element 23, where the element 23 is composed of a semiconductor element possessed of the Peltier effect sandwiched between ceramic boards 24 and 25. then a current and a voltage applied to the electrodes of the element 23 are controlled, thermal energy is transferred in one direction through the element 23 to enable the element 21 to be cooled down to an appropriate temperature.
公开日期	1990-08-03
申请日期	1989-01-26
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/63198]
专题	半导体激光器专利数据库
作者单位	FUJITSU LTD
推荐引用方式 GB/T 7714	GOTO MASAMI. Semiconductor laser assembly with built-in electronic cooling element. JP1990197185A. 1990-08-03.

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