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	Optical integrated circuit package
	KIMURA SOUICHI; SHIBATA ATSUSHI
	1985-06-15
著作权人	MATSUSHITA DENKI SANGYO KK
专利号	JP1985110185A
国家	日本
文献子类	发明申请
其他题名	Optical integrated circuit package
英文摘要	PURPOSE:To improve the thermal dissipation, to increase the lifetime and to enhance the reliability by composing of the first package metallized from terminal lead wirings and the second package made of a solid piece having large thermal conductivity on a ceramic substrate. CONSTITUTION:Lead wirings 4 connected with external leads 3 are metallized on a ceramic substrate 1 formed with a recess, internal leads 5 are connected as the first package, the projection 11 of the second package made of metal piece 10 of a copper material is coupled with epoxy resin with the recess and integrated. An Si submount 21 is die bonded along the projection 11 and then an optical integrated circuit chip 20 integrated with the semiconductor laser and the drive circuit are die-bonded, electrode pads 23 of the chip 20 and the leads 5 are wire bonded with wirings 22. The heat generated at the chip 20 is transmitted to the piece 10 having large thermal conductivity, thereby improving the heat dissipation.
公开日期	1985-06-15
申请日期	1983-11-18
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/62903]
专题	半导体激光器专利数据库
作者单位	MATSUSHITA DENKI SANGYO KK
推荐引用方式 GB/T 7714	KIMURA SOUICHI,SHIBATA ATSUSHI. Optical integrated circuit package. JP1985110185A. 1985-06-15.

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