QQ客服 官方微博 反馈留言

	Assembling method for semiconductor light emitting device
	HIGUCHI HIDEYO; OOMURA ETSUJI
	1982-04-05
著作权人	MITSUBISHI DENKI KK
专利号	JP1982056984A
国家	日本
文献子类	发明申请
其他题名	Assembling method for semiconductor light emitting device
英文摘要	PURPOSE:To readily assemble a semiconductor light emitting element by etching the edge lines of two surfaces crossing with one another at the front surface side of a heat sink soldering the element along the edge line, chamfering it and soldering the element so that the light emitting end face of the element and the front surface of the sink become in the same plane. CONSTITUTION:The edge line of two surfaces crossing with one another at the front surface side of a heat sink carrying a semiconductor laser 2 is etched along the edge line, and a chamfering part 7 is formed. The light emitting end face 4 of a laser 2 is diposed at the chamfering part 7, and the light emitting unit 3 and the sink 2 are secured to one another by soldering while maintaining the light emitting unit 3 and the side face of the sink 1 in the same plane. Since the chamfering part 7 is produced with rounded chamfering unit 7' in this manner, solder 5 is sufficiently flowed to eliminate the cavity or the like, and even if the position of the laser 2 is slightly displaced, the fluctuation, shortcircuit and leakage of the emitted light can be remarkably reduced.
公开日期	1982-04-05
申请日期	1980-09-23
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/62805]
专题	半导体激光器专利数据库
作者单位	MITSUBISHI DENKI KK
推荐引用方式 GB/T 7714	HIGUCHI HIDEYO,OOMURA ETSUJI. Assembling method for semiconductor light emitting device. JP1982056984A. 1982-04-05.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。