Submount, semiconductor laser device, and thermally assisted hard disk device
IJIMA SHINICHI; NAGANO KAZUMASA; IKEDO NORIO
2019-02-07
著作权人PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
专利号WO2019026474A1
国家世界知识产权组织
文献子类发明申请
其他题名Submount, semiconductor laser device, and thermally assisted hard disk device
英文摘要A submount (100) comprises a substrate (110), the substrate (110) having: a first surface (101); a second surface (102) that is substantially perpendicular to the first surface (101); a third surface (103) that is substantially perpendicular to the first surface (101) and the second surface (102); a fourth surface (104) that is substantially perpendicular to the first surface (101) and the second surface (102), and faces the third surface (103); a fifth surface (105) that is substantially perpendicular to the second surface (102), the third surface (103), and the fourth surface (104), and faces the first surface (101); a sixth surface (106) that faces the second surface (102); a first notch part (113a) that is formed in a portion at which the second surface (102) and the third surface (103) are adjacent; and a second notch part (113b) that is formed in a portion at which the second surface (102) and the fourth surface (104) are adjacent, the first notch part (113a) and the second notch part (113b) each having a recessed surface that includes a curved surface.
公开日期2019-02-07
申请日期2018-06-26
状态未确认
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/62377]  
专题半导体激光器专利数据库
作者单位PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
推荐引用方式
GB/T 7714
IJIMA SHINICHI,NAGANO KAZUMASA,IKEDO NORIO. Submount, semiconductor laser device, and thermally assisted hard disk device. WO2019026474A1. 2019-02-07.
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