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	Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device
	TANAKA, KOICHIRO
	2005-02-10
著作权人	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
专利号	US20050031261A1
国家	美国
文献子类	发明申请
其他题名	Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device
英文摘要	A cylindrical lens array cannot be manufactured so that each cylindrical lens has the same radius of curvature and the same accuracy in the surface. Therefore, when the laser annealing is performed using the cylindrical lens array, the beam spots divided by the cylindrical lens array cannot be superposed completely in the same surface. As a result, there is a region where the energy is attenuated in the edge portion of the rectangular beam to be formed, and therefore the intensity distribution of the laser beam becomes inhomogeneous. In the present invention, the cylindrical lens array is used in combination with the optical waveguide. After dividing the laser beam in a predetermined direction by the cylindrical lens array, the divided beams are combined, and then the laser beam is incident into the optical waveguide that acts upon the same direction as the predetermined direction. This can correct the variation in the intensity of the laser beam due to the processing inaccuracy of the cylindrical lens array.
公开日期	2005-02-10
申请日期	2004-07-08
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/61112]
专题	半导体激光器专利数据库
作者单位	SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
推荐引用方式 GB/T 7714	TANAKA, KOICHIRO. Beam homogenizer, laser irradiation apparatus and method for manufacturing semiconductor device. US20050031261A1. 2005-02-10.

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