QQ客服 官方微博 反馈留言

	Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof
	KIM, JAY EUNJAE
	2017-09-07
著作权人	KIM, JAY EUNJAE
专利号	US20170254574A1
国家	美国
文献子类	发明申请
其他题名	Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof
英文摘要	A direct refrigeration cooling platform can cool high heat density sources such as LEDs, IC chip, power amplifiers and laser diodes. The platform utilizes a combination of technologies from a water cooled cold plate design and a vapor compression refrigeration system. The cold plate of the direct refrigeration cooling platform replaces an evaporator in a conventional vapor compression refrigeration cycle. High heat density sources are directly mounted onto the cold plate. Temperature of the cold plate is regulated based on temperature feedback and is maintained above ambient temperatures. For LED applications, a number of LEDs are mounted onto the cold plate of the direct refrigeration cooling platform. Beams of light are distributed via fiber optic light guides to remote and inaccessible locations, where light sources are to be replaced. IC chips are cooled the same way with IC chips attached to the cold plate of the direct refrigeration cooling platform.
公开日期	2017-09-07
申请日期	2016-08-30
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/59099]
专题	半导体激光器专利数据库
作者单位	KIM, JAY EUNJAE
推荐引用方式 GB/T 7714	KIM, JAY EUNJAE. Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof. US20170254574A1. 2017-09-07.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。