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	Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
	MEEHAN, RUDI O'REILLY; AGARWAL, AKSHAT; JEFFERS, NICHOLAS M.
	2019-03-14
著作权人	NOKIA TECHNOLOGIES OY
专利号	US20190081453A1
国家	美国
文献子类	发明申请
其他题名	Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
英文摘要	There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.
公开日期	2019-03-14
申请日期	2018-09-06
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/57736]
专题	半导体激光器专利数据库
作者单位	NOKIA TECHNOLOGIES OY
推荐引用方式 GB/T 7714	MEEHAN, RUDI O'REILLY,AGARWAL, AKSHAT,JEFFERS, NICHOLAS M.. Package, and method of manufacturing a package comprising an enclosure and an integrated circuit. US20190081453A1. 2019-03-14.

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