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	Bonded laser with solder-free laser active stripe in facing relationship with submount
	NADEAU, MARY; NEIMAN, JARRETT S.; PANNALA, MITTU
	2018-08-23
著作权人	CISCO TECHNOLOGY, INC.
专利号	WO2018151950A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Bonded laser with solder-free laser active stripe in facing relationship with submount
英文摘要	A laser light source, a submount for a semiconductor laser, and a method of providing a laser light source are provided. The laser light source includes a submount with first and second electrical contacts thereon and a trench therebetween. A semiconductor laser is bonded to the submount by bonding third and fourth electrical contacts of the laser to the first and second electrical contacts, respectively. The third and fourth electrical contacts of the laser are arranged on opposite side of a laser active stripe, which is arranged over the trench of the submount.
公开日期	2018-08-23
申请日期	2018-02-01
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/57692]
专题	半导体激光器专利数据库
作者单位	CISCO TECHNOLOGY, INC.
推荐引用方式 GB/T 7714	NADEAU, MARY,NEIMAN, JARRETT S.,PANNALA, MITTU. Bonded laser with solder-free laser active stripe in facing relationship with submount. WO2018151950A1. 2018-08-23.

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