Iii-v chip preparation and integration in silicon photonics | |
LAMBERT, DAMIEN | |
2017-11-16 | |
著作权人 | SKORPIOS TECHNOLOGIES, INC. |
专利号 | WO2017197132A1 |
国家 | 世界知识产权组织 |
文献子类 | 发明申请 |
其他题名 | Iii-v chip preparation and integration in silicon photonics |
英文摘要 | A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser. |
公开日期 | 2017-11-16 |
申请日期 | 2017-05-11 |
状态 | 未确认 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/57581] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | SKORPIOS TECHNOLOGIES, INC. |
推荐引用方式 GB/T 7714 | LAMBERT, DAMIEN. Iii-v chip preparation and integration in silicon photonics. WO2017197132A1. 2017-11-16. |
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