| Optical interconnect for switch applications | |
| HEANUE, JOHN; PEZESHKI, BARDIA; AMSDEN, CHARLES; SOLDANO, LUCAS | |
| 2019-03-07 | |
| 著作权人 | T&S COMMUNICATIONS CO. LTD. |
| 专利号 | US20190072720A1 |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical interconnect for switch applications |
| 英文摘要 | A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array. |
| 公开日期 | 2019-03-07 |
| 申请日期 | 2018-04-24 |
| 状态 | 申请中 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54891]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | T&S COMMUNICATIONS CO. LTD. |
| 推荐引用方式 GB/T 7714 | HEANUE, JOHN,PEZESHKI, BARDIA,AMSDEN, CHARLES,et al. Optical interconnect for switch applications. US20190072720A1. 2019-03-07. |
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