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	Optoelectronic integrated semiconductor module and method for manufacturing same
	FURUYAMA, HIDETO
	2019-04-25
著作权人	KABUSHIKI KAISHA TOSHIBA
专利号	US20190123231A1
国家	美国
文献子类	发明申请
其他题名	Optoelectronic integrated semiconductor module and method for manufacturing same
英文摘要	According to one embodiment, the electric interconnection layer includes a metal interconnection and an insulating film. The optical device is provided within the electric interconnection layer, and electrically connected to the metal interconnection. The optical device includes at least one of a light emitting element and a light receiving element. The optical waveguide is provided within the electric interconnection layer, and optically coupled to the optical device. The semiconductor devices are provided on a first face of the electric interconnection layer, and electrically connected to the metal interconnection. The resin seals the semiconductor devices. The external connection terminals are provided on a second face of the electric interconnection layer, and electrically connected to the metal interconnection.
公开日期	2019-04-25
申请日期	2018-03-09
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54865]
专题	半导体激光器专利数据库
作者单位	KABUSHIKI KAISHA TOSHIBA
推荐引用方式 GB/T 7714	FURUYAMA, HIDETO. Optoelectronic integrated semiconductor module and method for manufacturing same. US20190123231A1. 2019-04-25.

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