| LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields | |
| MEHNERT, ALEX | |
| 2017-06-08 | |
| 著作权人 | KONINKLIJKE PHILIPS N.V. |
| 专利号 | WO2017095712A1 |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields |
| 英文摘要 | Cathode and anode electrodes are located on the bottom surface of an LED submount along a center line of the bottom surface. Two thermal pads are located on either side of the electrodes along opposite sides of the bottom surface. This configuration results in less stress on solder bonding the electrodes to a circuit board. Further, since the heat conducted by the two thermal pads is not choked by the electrodes, the heat spreads more uniformly into the circuit board. Further, since the metal design is symmetrical in that the outer thermal pads are identical, the molten solder will have the same shape over both thermal pads, causing the LED die and submount to be not tilted with respect to the surface of the circuit board. Other configurations are described that also improve the thermal and electrical characteristics of the LED die. |
| 公开日期 | 2017-06-08 |
| 申请日期 | 2016-11-23 |
| 状态 | 未确认 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54745]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KONINKLIJKE PHILIPS N.V. |
| 推荐引用方式 GB/T 7714 | MEHNERT, ALEX. LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields. WO2017095712A1. 2017-06-08. |
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