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	Micro-hoses for integrated circuit and device level cooling
	MILNE, JASON G.
	2016-12-08
著作权人	RAYTHEON COMPANY
专利号	WO2016196929A2
国家	世界知识产权组织
文献子类	发明申请
其他题名	Micro-hoses for integrated circuit and device level cooling
英文摘要	A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
公开日期	2016-12-08
申请日期	2016-06-03
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54699]
专题	半导体激光器专利数据库
作者单位	RAYTHEON COMPANY
推荐引用方式 GB/T 7714	MILNE, JASON G.. Micro-hoses for integrated circuit and device level cooling. WO2016196929A2. 2016-12-08.

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