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	Metal resin complex
	EZAKI, TOSHIAKI
	2018-04-11
著作权人	KANEKA CORPORATION
专利号	EP3305519A1
国家	欧洲专利局
文献子类	发明申请
其他题名	Metal resin complex
英文摘要	The present invention provides a metal resin composite including a thermally conductive resin composition and a surface-treated metal which are integrally molded by injection molding to be tightly joined to each other at an interface between the resin and the metal, the metal resin composite excelling in heat radiation property and moldability, being light in weight, and being easily producible. The metal resin composite includes a member made of thermally conductive resin composition and a member made of metal and including a surface on which fine recesses are formed by a surface treatment, these members contacting with each other and being joined to each other in such a manner that the thermally conductive resin composition flows into and is fixed to the recesses by injection molding of the thermally conductive resin composition, wherein: the thermally conductive resin composition contains a thermoplastic resin (A) and an inorganic filler (B); thermal conductivity of the thermally conductive resin composition in a surface direction (In-Plane thermal conductivity) is 1 W/(m·K) or more; and the inorganic filler (B) is at least one selected from the group consisting of inorganic particles (B1) having thermal conductivity of 2 W/(m·K) or more and a volume average particle diameter of 1 to 700 µm and inorganic fibers (B2) having thermal conductivity of 1 W/(m·K) or more, a number average fiber diameter of 1 to 50 µm, and a number average fiber length of 6 mm or less.
公开日期	2018-04-11
申请日期	2016-05-30
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54698]
专题	半导体激光器专利数据库
作者单位	KANEKA CORPORATION
推荐引用方式 GB/T 7714	EZAKI, TOSHIAKI. Metal resin complex. EP3305519A1. 2018-04-11.

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