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	Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing
	ISHII, KUNIYUKI; KURASHIMA, HIROMI
	2016-08-25
著作权人	SUMITOMO ELECTRIC INDUSTRIES, LTD.
专利号	US20160246019A1
国家	美国
文献子类	发明申请
其他题名	Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing
英文摘要	A pluggable optical transceiver that enhances the heat dissipation function is disclosed. The optical transceiver provides the MPO connector that receives an external MT ferrule, the assembly substrate that installs a semiconductor optical device, a lens block that bends the optical axis of the semiconductor optical device by about 90°, the circuit board electrically connected to the assembly substrate, the inner fiber optically couples the WO connector with the lens block, and the top and bottom housings that installs the MPO connector, the assembly substrate, the circuit board, and the inner fiber therein. The bottom housing mounts the circuit board, while, the assembly substrate is thermally and physically in contact to the top housing through a thermal grease.
公开日期	2016-08-25
申请日期	2016-02-23
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54661]
专题	半导体激光器专利数据库
作者单位	SUMITOMO ELECTRIC INDUSTRIES, LTD.
推荐引用方式 GB/T 7714	ISHII, KUNIYUKI,KURASHIMA, HIROMI. Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing. US20160246019A1. 2016-08-25.

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