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	Silicon-Based Cooling Package for Light-Emitting Devices
	KIM, GERALD HO; KIM, JAY EUNJAE
	2014-10-30
著作权人	KIM, GERALD HO
专利号	US20140321489A1
国家	美国
文献子类	发明申请
其他题名	Silicon-Based Cooling Package for Light-Emitting Devices
英文摘要	Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a non-metal base plate and a silicon-based cover element disposed on the base plate. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the one or more light-emitting devices between the base plate and the cover element with at least a portion of a light-emitting surface of each of the one or more light-emitting devices exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.
公开日期	2014-10-30
申请日期	2014-07-06
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54520]
专题	半导体激光器专利数据库
作者单位	KIM, GERALD HO
推荐引用方式 GB/T 7714	KIM, GERALD HO,KIM, JAY EUNJAE. Silicon-Based Cooling Package for Light-Emitting Devices. US20140321489A1. 2014-10-30.

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