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	Distributed cooling of arrayed semi conductor radiation emitting devices
	KATZ JONATHAN M.; JOHNSON BENJAMIN D.
	2014-04-18
著作权人	PRESSCO IP LLC
专利号	IN10087CHENP2012A
国家	印度
文献子类	发明申请
其他题名	Distributed cooling of arrayed semi conductor radiation emitting devices
英文摘要	Techniques for the removal of waste heat from solid state semiconductor devices (such as cooking or heating devices) are provided. In particular techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition a multi head cooling system applicable to multiple solid state semiconductor sources is provided.
公开日期	2014-04-18
申请日期	2012-11-30
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54389]
专题	半导体激光器专利数据库
作者单位	PRESSCO IP LLC
推荐引用方式 GB/T 7714	KATZ JONATHAN M.,JOHNSON BENJAMIN D.. Distributed cooling of arrayed semi conductor radiation emitting devices. IN10087CHENP2012A. 2014-04-18.

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