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	Method of bonding a substrate to a semiconductor light emitting device
	BASIN, GRIGORIY; EPLER, JOHN EDWARD; MARTIN, PAUL SCOTT
	2014-07-10
著作权人	LUMILEDS LLC
专利号	US20140193931A1
国家	美国
文献子类	发明申请
其他题名	Method of bonding a substrate to a semiconductor light emitting device
英文摘要	A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).
公开日期	2014-07-10
申请日期	2012-07-30
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54360]
专题	半导体激光器专利数据库
作者单位	LUMILEDS LLC
推荐引用方式 GB/T 7714	BASIN, GRIGORIY,EPLER, JOHN EDWARD,MARTIN, PAUL SCOTT. Method of bonding a substrate to a semiconductor light emitting device. US20140193931A1. 2014-07-10.

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