Optical module with a lens encapsulated within sealant and method for manufacturing the same
TANAKA, KAZUNORI; MII, KAZUAKI; TAKAGI, TOSHIO; SANO, TOMOMI; KOGUCHI, KEITARO
2013-04-18
著作权人SUMITOMO ELECTRIC INDUSTRIES, LTD.
专利号US20130093071A1
国家美国
文献子类发明申请
其他题名Optical module with a lens encapsulated within sealant and method for manufacturing the same
英文摘要A method to manufacture an optical module is disclosed, wherein the optical module has an optically active device on a lead frame and a lens co-molded with the active device and the lead frame by a transparent resin as positioning the lens with respect to the lead frame. The molding die of the present invention has a positioning pin to support the lens during the molding. Because the lead frame is aligned with the molding die, the precise alignment between the active device on the lead frame and the lens is not spoiled during the molding.
公开日期2013-04-18
申请日期2011-07-04
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/54248]  
专题半导体激光器专利数据库
作者单位SUMITOMO ELECTRIC INDUSTRIES, LTD.
推荐引用方式
GB/T 7714
TANAKA, KAZUNORI,MII, KAZUAKI,TAKAGI, TOSHIO,et al. Optical module with a lens encapsulated within sealant and method for manufacturing the same. US20130093071A1. 2013-04-18.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace