Optical module with a lens encapsulated within sealant and method for manufacturing the same | |
TANAKA, KAZUNORI; MII, KAZUAKI; TAKAGI, TOSHIO; SANO, TOMOMI; KOGUCHI, KEITARO | |
2013-04-18 | |
著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
专利号 | US20130093071A1 |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Optical module with a lens encapsulated within sealant and method for manufacturing the same |
英文摘要 | A method to manufacture an optical module is disclosed, wherein the optical module has an optically active device on a lead frame and a lens co-molded with the active device and the lead frame by a transparent resin as positioning the lens with respect to the lead frame. The molding die of the present invention has a positioning pin to support the lens during the molding. Because the lead frame is aligned with the molding die, the precise alignment between the active device on the lead frame and the lens is not spoiled during the molding. |
公开日期 | 2013-04-18 |
申请日期 | 2011-07-04 |
状态 | 授权 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/54248] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
推荐引用方式 GB/T 7714 | TANAKA, KAZUNORI,MII, KAZUAKI,TAKAGI, TOSHIO,et al. Optical module with a lens encapsulated within sealant and method for manufacturing the same. US20130093071A1. 2013-04-18. |
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