QQ客服 官方微博 反馈留言

	Light emitting device package and method of manufacturing the same
	CHAN, SHIUN-WEI; KE, CHIH-HSUN
	2012-03-29
著作权人	ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
专利号	US20120074452A1
国家	美国
文献子类	发明申请
其他题名	Light emitting device package and method of manufacturing the same
英文摘要	A light emitting device package includes a base, a light emitting element, a mask, metal wires, an encapsulating layer and a cover layer. The base has a first surface bearing electrical structure thereon and an opposite second surface. The mask is arranged on the first surface to define a space receiving the light emitting element. Two openings are defined in the mask. The light emitting element has two pads exposed to an outside through the two openings respectively. The metal wires electrically connect the pads and the electrical structures. The encapsulating layer is filled in the space and two through holes in the base and encapsulates the light emitting element. The encapsulating layer is separated from the metal wires. The cover layer covers and protects the mask and the metal wires. A method of manufacturing the package is also provided.
公开日期	2012-03-29
申请日期	2011-06-29
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54247]
专题	半导体激光器专利数据库
作者单位	ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
推荐引用方式 GB/T 7714	CHAN, SHIUN-WEI,KE, CHIH-HSUN. Light emitting device package and method of manufacturing the same. US20120074452A1. 2012-03-29.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。